Satisfying rugged memory requirements

While demands for ruggedized embedded devices continue to rise, memory module suppliers continue to make technology advancements and associated manufacturing enhancements that meet the needs of OEMs. DDR3 SODIMM, DDR3L, and lower-profile DDR3L are all examples of new technologies that help satisfy rugged memory requirements. These advancements solve many design challenges, including low power, enhanced thermal dissipation, and extended-temperature tolerance while delivering the performance needed for today’s complex embedded systems.

refer to : http://embedded-computing.com/articles/ruggedization-memory-module-design/