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2013年10月1日 星期二

Tips 101: Safety options for automotive chips


Redundant critical on-chip modules like processor, ISO, DMA controller, internal clock generator, and communications peripherals can improve reliability should a primary hardware module become non-functional while the vehicle is running. Such a system can have in-built error detection mechanisms and on-the-fly switching to redundant hardware to mitigate threats to passenger safety.
But this kind of redundant hardware architecture comes with the penalty of increased area and higher power management in silicon. Area penalties can be minimized by intelligent selection of which functions need to be duplicated in silicon. Power can be minimized by adopting power and clock gating in the redundant modules. Some  in-vehicle computers can be implemented in lock-step of each other, where primary and redundant modules process the same input. Mismatch in the output of the lock-step modules indicates a defect in either of the modules. The system can switch itself off or take appropriate safety measures to avoid any real-time failure. Redundant hardware should be placed quite far in silicon from the primary embedded systems to avoid tampering of both modules together.


refer to: http://www.edn.com/design/automotive/4421704/Safety---security-architecture-for-automotive-ICs

2013年3月25日 星期一

Growing pressure to boost the performance

Embedded PC, in vehicle PC, Industrial PC
In response to growing pressure to boost the performance and trim down the size of embedded applications, standards organizations meet regularly to optimize their portfolios in light of the latest available technology. These updated standards take advantage of new silicon architecture combining multiple processors, graphics elements, and complex I/O to deliver the next generation of preengineered, off-the-shelf modules to support many of the high-performance requirements of embedded product development.
These standardized computer platforms allow designers to trade in substantial savings in Non-Recurring Engineering (NRE) and scheduling for slightly higher recurring costs. Standards-based designs also shortcut the software development effort by providing access to compatible operating systems, vendor-supplied drivers, and sample firmware.
In the Strategies section of this issue, we asked experts from several standards organizations to bring us up to date on the latest changes affecting embedded designs. Starting things off, Jim Blazer, CTO at RTD Embedded Technologies and active member of the PC/104 Consortium, presents the history and updates in work – such as the latest generation of PCI Express – that support the PC/104 stackable architecture. Citing the need for smaller and more rugged building blocks, Alexander Lockinger, President of the Small Form Factor Special Interest Group (SFF-SIG) and CTO at Ascend Electronics, covers the trends and new products to expect in 2013. In addition, Jerry Gipper, Director of Marketing at VITA and Editorial Director ofVITA Technologies magazine, reports on the recent Embedded Tech Trends 2013 meeting aboard the Queen Mary and standards work in progress, plus some new technologies such as optical interconnects.